At present, the electronic components and chips toward more and more complex direction, and the traditional IC integrated device package and metal tube package will bring difficulties. Such as MEMS sensors, in order to improve its performance, often need to increase the thickness of the movable mass, the use of traditional IC integrated device packaging technology and domestic and international standard LCC (leadless chip carrier) package tube cavity depth often can not meet MEMS thickness requirements, which greatly caused the package and micro-assembly process complexity, and the overall chip area is large, increasing the cost is not conducive to mass production.
Xue Xu, an engineer at the Institute of Geology and Geophysics, Chinese Academy of Sciences, invented an integrated packaging method suitable for MEMS, especially MEMS inertial sensors, with a comb-tooth type MEMS accelerometer as an exemplary embodiment and recently obtained the national invention patent authorization Patent Name: A MEMS sensor packaging structure and its packaging method; Inventor: Xue Xu, Guo Shichao; Patent No .: ZL 2014 1 0183524.9). In view of the deficiency of the prior art, they provide a base that can be conveniently expanded to a multi-level structure according to needs, and the wires can be arranged in a base in a layered manner to solve the problem of difficult wiring. In addition, they also provide a low package stress and tightness of the package structure, low temperature parallel seam welding to take the low temperature packaging technology. MEMS and the base bonding process and material matching and temperature sensors and MCU processor layout effectively, from the material stress, algorithm compensation, real-time temperature calibration, and many other aspects to solve the MEMS inertial sensors, especially MEMS acceleration sensor temperature coefficient, temperature Hysteresis and other challenges, improve production efficiency and reduce costs.
The invention solves a series of MEMS problems in terms of bias stability, temperature characteristics and engineering, and related technologies have been trial-produced in small quantities on prototypes and products of the research group with good results achieved initially The engineering and production capacity, with some promotion and application prospects.
An embodiment of a MEMS sensor package structure
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